Black swan on black background (Cygnus atratus)

Boosting U.S. AI: SK hynix Partners for Advanced Semiconductor Facility

The U.S. Department of Commerce and SK hynix have signed a preliminary memorandum of terms to provide up to $450 million in federal incentives under the CHIPS and Science Act. This initiative, part of the Biden-Harris Administration’s efforts to strengthen domestic semiconductor manufacturing, aims to establish an advanced packaging and R&D facility in West Lafayette, Indiana. The project builds on SK hynix’s $3.87 billion investment and will create approximately 1,000 jobs and enhance the U.S. AI supply chain by producing high-bandwidth memory crucial for AI systems.

Continue reading the article from NIST Headquarters…